Maintenance method of high and low temperature test chamber

The high and low temperature test box is used for material experiment, electronic and electrical performance experiment, function test of equipment and equipment in automotive, aerospace and other fields. It is composed of different design combinations of far infrared focusing and heating technology, unipolar refrigeration unit, bipolar refrigeration unit and cascade refrigeration unit. The following section describes the instrument panel maintenance method of the high and low temperature test chamber:

1、 Replacement method

1. Component replacement method: it is required to have two high and low temperature test chambers of the same model or accessories. Replace a good spare part with the same electronic components in the small trouble machine to see if the small trouble is eliminated.

2. Function replacement method: when the function of a part of the machine with minor defects is missing, because the original spare parts cannot be found for a while, the main parameters of the recycled or cheap electrical equipment can be replaced with the same function or close to the components according to the circuit principle of the part, and the detailed plan for repairing the instruments and equipment can be reached.

2、 Temperature rise and fall method

1. Temperature rise and fall method

Sometimes, the instrument panel works for a long time, or when the working temperature is high in summer, it shows small problems. The standby check is normal, it starts again after a period of time, and it shows small problems again after a moment. This behavior is caused by the poor performance of individual lC or electronic devices, and the main parameters of high temperature characteristics can not meet the target requirements. In order to find out the cause of small defects, the temperature rise and fall method can be used for precision machining.

The so-called temperature reduction is also to wipe the anhydrous ethanol on the parts that may have problems with cotton fiber when the small problems are displayed to reduce the temperature and observe whether the small problems are eliminated; The so-called temperature raising also refers to artificially raising the working temperature. For example, place the electric ferrochrome near the questionable part (be careful not to raise the temperature too high to damage the normal components) to see if the small problems show up.

3、 Exclusion method

The so-called elimination method of the high and low temperature test chamber is to identify the cause of small defects by plugging and unplugging some software boards and components of the body. When the surface of a software board or component is recovered after being unplugged, it indicates that there is a small problem. This method is also a method that technicians probably master and skillfully use.